Visit Mobiveil’s Exhibit Booth at Flash Memory Summit 2015

Visit Mobiveil’s Exhibit Booth at Flash Memory Summit 2015; Join the Company’s Two Technical Presentations; Attend Mobiveil-Sponsored FMS Theater; and View New Product Showcase

What:  Flash Memory Summit 2015 is three days of seminars, forums, keynotes, and sessions on the topic of flash memory for consumer, computer and enterprise markets. Flash is fast replacing rotating hard drives as storage medium in Mobile, Client and Enterprise applications. The technology is undergoing rapid change as system architects devise new ways to exploit its unique qualities. The Flash Memory Summit presents up to date developments on this rapidly evolving technology.

Who:  Mobiveil will have a major presence at Flash Memory Summit 2015. Mobiveil Chief Architect, Steven Shrader, will present “Addressing Flash Reliability with LDPC” during Forum B-12 Flash-Memory Based Architectures on Tuesday, August 11 from 3:15 to 5:45 pm and Mobiveil VP of Engineering, Amit Saxena, will present “An FPGA based NVMe SSD Platform” during Forum J-31 PCIe/NVMe Storage on Thursday, August 13 from 8:30 to 10:50 am. The company is also sponsoring the Flash Memory Summit Theater on the exhibit floor, where visitors can hear the latest product information from Mobiveil and others presenters during the two days the theater is opened: Wednesday August 12 starting at 12:20 PM and Thursday August 13 starting at 10:20 AM.

Why:  The data centers in e-commerce and social media companies, such as Amazon, Facebook, Google, and others need instant access to the huge amounts of data in their hard drive farms. To accelerate access, these data centers have been installing increasing amounts of high-speed NVM flash cache in their servers and between servers and disk farms. The design activity to create boards and chips to implement solutions to meet this demand continues to increase.  Mobiveil and its partners Altera and NVMdurance will be displaying the FPGA based Enterprise storage solution that they developed in collaboration.

Who should attend:  System on Chip, ASIC, and FPGA architects, designers, and developers creating solutions for networking, storage, and enterprise applications.

When: From August 11 to 13, join CEO Ravi Thummarukudy and other members of the Mobiveil team at booth 610 on the exhibit floor during exhibit hours on Wednesday from 12:00 pm to 7:00 pm and Thursday from 10:00 am to 2:00 pm.  Also attend the company’s presentation ”Addressing Flash Reliability with LDPC” on Tuesday, August 11 from 3:15 to 5:45 pm and “An FPGA based NVMe SSD Platform” on Thursday, August 13 from 8:30 to 10:50 am. On Wednesday August 12, be at the Flash Memory Summit Theater on the exhibition floor from 12:20 to 12:30 to hear Mobiveil formally open the theater for presentations and come by later at 5:45 to 6:00 pm to hear Mobiveil’s product presentation. The product will also be on display in the New Product Showcase on the exhibit floor. If you would like to make an appointment to meet Mobiveil executives during the event, please e-mail

Where:  Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA 95054, Halls A-C.

About Mobiveil

Mobiveil is a fast‐growing technology company that specializes in development of Silicon Intellectual Properties, platforms and solutions for the networking, storage and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, and high-speed serial interconnect Silicon IP cores and custom and standard form factor hardware boards to leading customers worldwide. With a highly motivated engineering team, dedicated integration support, flexible business models, strong industry presence through strategic alliances and key partnerships, Mobiveil solutions have added tremendous value to the customers in executing their product goals within budget and on time. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India, and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan and People Republic of China. For more information, please visit

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