Mobiveil participated in Global RapidIO Design Submit – Asia 2013
Eco-system members join to present the latest product, application and standard developments pushing performance up to 40 Gbps per port and new market initiatives
AUSTIN, TEXAS, October 14, 2013 – The RapidIO Trade Association announced its 2013 Global Design Summit schedule, with events slated for Taipei, Taiwan, Shanghai and Beijing. These highly anticipated events provide product managers, engineering managers, system architects, and embedded product developers with practical information on RapidIO technology and products they can utilize now in their production products.
Hosted by the RapidIO Trade Association Members, the 2013 Global Design Summit presentations and demonstrations are supplied by the Trade Association member companies. Presenters including Fabric Embedded Tools, Freescale, Integrated Device Technology, Mobiveil, Prodrive and Texas Instruments are leading vendors of embedded processors, DSPs, RapidIO switches and supporting IP and tools.
“These summits, developed specifically to illustrate how the embedded design community can achieve improved system performance and reliability with the high-speed, flexible RapidIO interconnect and fabric, are among the most highly attended RapidIO design events held each year,” said Devashish Paul, Marketing Council Chairman of the RapidIO Trade Association. “The member companies of the RapidIO Trade Association are dramatically expanding the presentations and demonstrations this year, with a focus on practical designs and implementations using RapidIO interconnect technology across markets.”
The free, full-day events include technical sessions highlighting RapidIO technology, applications examples in wireless, embedded, imaging, aerospace, medical and video. The event also covers software considerations, practical design recommendations, and RapidIO products and will also show case RTA progress on the 10xN specification as well as the Data Center Compute and Networking task group initiative. Technical personnel from trade association member companies will provide a unique opportunity for attendees to interact directly with RapidIO technology experts and get their specific questions answered. A complimentary lunch will be provided to attendees.
Global RapidIO Design Summits Schedule
Taipei, Taiwan – Monday Oct. 28, 2013
Shanghai, China – Tuesday Nov. 5, 2013
Beijing, China – Thursday Nov. 7, 2013
Additional details can be found on www.RapidIO.org.
RapidIO Trade Association
The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO and ANSI-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.
RapidIO Trade Association